IPC目錄大全

一、設(shè) 計（Design）部分

IPC-M-106 Technology Reference for Design Manual 設(shè)計技術(shù)手冊

IPC-2220 Design Standard Series 設(shè)計標(biāo)準(zhǔn)系列手冊

IPC-2221A Generic Standard on Printed Board Design 印制板設(shè)計通用標(biāo)準(zhǔn)

IPC-2222 Sectional Standard on Rigid Organic Printed Boards剛性有機(jī)印制板設(shè)計分標(biāo)準(zhǔn)

IPC-2223 Sectional Design Standard for Flexible Printed Boards撓性印制板設(shè)計分標(biāo)準(zhǔn)

IPC-2224 Sectional Standard of Design of PWB for PC Card PC卡用印制電路板分設(shè)計分標(biāo)準(zhǔn)

IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有機(jī)多芯片模塊(MCM-L)及其組裝件設(shè)計分標(biāo)準(zhǔn)

IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互連(HDI)印制板設(shè)計分標(biāo)準(zhǔn)

IPC-SM-782A Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 表面安裝設(shè)計及連接盤圖形標(biāo)準(zhǔn)(包括修訂1和2)

IPC-EM-782 Surface Mount Design & Land Pattern Standard Spreadsheet表面安裝設(shè)計及連接盤圖形標(biāo)準(zhǔn)

IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多層混合電路設(shè)計標(biāo)準(zhǔn)

IPC-1902 IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制電路網(wǎng)格體系

SMC-WP-004 Design for Success 成功的綜合設(shè)計分析手冊

IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart 印制板缺陷評估圖冊

IPC/JPCA-2315 Design Guide for High Density Interconnects & Microvias高密度互連(HDI)和微通孔設(shè)計指南

IPC-2615 Printed Board Dimensions and Tolerances 印制板尺寸和公差

IPC-A-311 Process Controls for Phototool Generation and Use照相版制作和使用的過程控制

IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安裝印制板組裝件技術(shù)設(shè)計導(dǎo)則

IPC-D-310C Guidelines for Phototool Generation and Measurement Techniques照相版制作指南和測量技術(shù)

IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用標(biāo)準(zhǔn)在制板尺寸的印制板尺寸選擇指南

IPC-D-422 Design Guide for Press Fit Rigid Printed Board Back Plane壓配合剛性印制背板設(shè)計指南

IPC-PWBADV-SG02 (HARD COPY)

IPC-PWB ADV-CD (CD) PCB Advanced Designer Certification Study Guide印制電路板高級設(shè)計師證書學(xué)習(xí)指南和多媒體光盤

IPC-PWB-CRT-SG01 (HARD COPY)

IPC-PWB-CERTCD1 (CD) PCB Designer Certification Study Guide 印制電路板設(shè)計師證書學(xué)習(xí)指南和多媒體光盤

IPC-2531 Standard Recipe File Format SpecificationSMEMA發(fā)布： 標(biāo)準(zhǔn)“菜單”（過程控制）文件格式規(guī)范注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}

IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication電子制造車間現(xiàn)場設(shè)備信息溝通(CAMX)通用要求

IPC-2546 Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印制板組裝設(shè)備分要求

IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 車間現(xiàn)場電子檢驗及測試設(shè)備信息溝通分要求

IPC-2571 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) 電子制造供應(yīng)鏈信息溝通分要求 產(chǎn)品數(shù)據(jù)交換

IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange 制成態(tài)產(chǎn)品-產(chǎn)品數(shù)據(jù)電子制造供應(yīng)鏈信息溝通分要求

IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange 材料單及產(chǎn)品設(shè)計構(gòu)造數(shù)據(jù)-產(chǎn)品數(shù)據(jù)交換供應(yīng)鏈信息溝通分要求

IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology 實施產(chǎn)品制造數(shù)據(jù)描述及其傳輸方法學(xué)的通用要求

IPC-2501 Definition for Web-Based Exchange of XML Data XML數(shù)據(jù)網(wǎng)絡(luò)交換定義

IPC-2511B Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML Schema Methodology實施產(chǎn)品制造數(shù)據(jù)描述及其網(wǎng)絡(luò)傳輸方法學(xué)的通用要求

IPC-2512A Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 實施制造數(shù)據(jù)描述管理方法的分要求

IPC-2513A Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 實施制造數(shù)據(jù)描述繪制方法的分要求

IPC-2514A Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 實施印制板制造數(shù)據(jù)描述的分要求

IPC-2515A Sectional Requirements for Implementation of Bare-Board Product Testing Data Description 實施裸板成品測試數(shù)據(jù)描述的分要求

IPC-2516A Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 實施已組裝板制造數(shù)據(jù)描述的分要求

IPC-2517A Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description 實施組裝件在線測試數(shù)據(jù)描述的分要求

IPC-2518A Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description 實施零部件制造數(shù)據(jù)描述的分要求

IPC-D-356B Bare Board Electrical Test Data Format 裸基板電檢測的數(shù)據(jù)格式

二、印 制 電 路 板（Printed Circuit Boards）

IPC-M-105 Rigid Printed Board Manual 剛性印制板設(shè)計手冊

IPC-D-325A Documentation Requirements for Printed Boards 印制板設(shè)計文件圖冊要求

IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和組裝的故障排除

IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制電路板質(zhì)量標(biāo)準(zhǔn)和性能規(guī)范系列手冊

IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能規(guī)范

IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 撓性印制板的鑒定與性能規(guī)范（包括修改單1）

IPC-6016 Qualification & Performance Specification for High Density Interconnect

(HDI) Layers or Boards 高密度互連(HDI)層或印制板的鑒定與性能規(guī)范

IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 剛性印制板的鑒定與性能規(guī)范 (包括修改單1)

IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的檢驗和測試

IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有機(jī)多芯片模塊(MCM-L)安裝及互連結(jié)構(gòu)的鑒定與性能規(guī)范

IPC-A-600F Acceptability of Printed Boards 印制板驗收條件

IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板質(zhì)量評價

IPC-QE-605A-KIT Hard Copy and CD 印制板質(zhì)量評價書和光盤(CD)

IPC-HM-860 Specification for Multilayer Hybrid Circuits多層混合電路規(guī)范

IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鑒定與性能

IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多層印制板的鑒定與性能規(guī)范用預(yù)制內(nèi)層在制板的鑒定與性能規(guī)范

IPC-TR-481 Results of Multilayer Tests Program Round Robin多層印制板聯(lián)合試驗計劃結(jié)果

IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于電子元件安裝與互連的印制板質(zhì)量評價

IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直徑鍍覆孔可靠性評價聯(lián)合試驗

IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制電路板表面非電鍍鎳/沉金規(guī)范

IPC-DR-572 Drilling Guidelines for Printed Boards 印制板鉆孔導(dǎo)則

IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔機(jī)加工方案的改進(jìn)和優(yōu)選手冊

IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers鉆床和銑床用計算機(jī)數(shù)字控制格式

IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗導(dǎo)則

IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互連微通孔技術(shù)綱要

IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials高密度互連(HDI)及微導(dǎo)通孔材料規(guī)范

IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互連(HDI)層或印制板的鑒定與性能規(guī)范

IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 積層/高密度互連的術(shù)語和定義、試驗方法與設(shè)計例

IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片組件內(nèi)層有機(jī)絕緣材料的鑒定試驗

IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔評價指標(biāo)手冊, 第一期第一版

IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔評價指標(biāo)手冊, 第一期第二版

IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔評價指標(biāo)手冊, 第一期第三版

IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技術(shù)成本核算

報告

IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗電路板與高速邏輯設(shè)計

IPC-2252 Design Guide for RF/Microwave Circuit Boards 射頻/微波電路板設(shè)計指南

IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高頻用基材規(guī)范

IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的檢驗和測試

IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技術(shù)電子封裝設(shè)計導(dǎo)則

IPC-M-102 Flexible Circuits Compendium 撓性電路綱要

IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry撓性印制線路用撓性絕緣基底材料

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 撓性印制線路覆蓋層用涂粘接劑絕緣薄膜

IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry撓性金屬箔去電應(yīng)用于柔性電路組裝

IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 撓性印制板的鑒定與性能規(guī)范（包括修改單1）

IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA單雙面撓性印制板性能手冊

IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits單面和雙面撓性電路組裝導(dǎo)則

IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制線路板復(fù)合金屬材料規(guī)范

IPC-MB-380 Guidelines for Molded Interconnection Devices 模壓互連器件導(dǎo)則

IPC-M-107 Standards for Printed Board Materials Manual 印制板材料標(biāo)準(zhǔn)手冊

IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收檢驗手冊

IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards剛性及多層印制板用基材規(guī)范

IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多層印制板用芯板結(jié)構(gòu)選擇導(dǎo)則

IPC-4562 Metal Foil for Printed Wiring Applications 印制線路用金屬箔

IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂樹脂金屬箔

IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards印制線路板復(fù)合金屬材料規(guī)范

IPC-TR-482 New Developments in Thin Copper Foils 薄銅箔的新發(fā)展

IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin StudyIPC銅箔延展性聯(lián)合研究結(jié)果

IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study銅箔斷裂強(qiáng)度試驗聯(lián)合研究結(jié)果

IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”類精紡玻璃纖維層印制板技術(shù)規(guī)范

IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纖維非織布材料規(guī)范及性能確定方法

IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纖維紙規(guī)范及性能確定方法

IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非織布規(guī)范及性能確定方法, 包括修改單 1

IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 關(guān)于聚芳基酰胺非織布規(guī)范及性能確定方法的修改單 1

IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用經(jīng)處理S玻璃纖維織物規(guī)范

IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用經(jīng)處理聚芳酰胺纖維編織物規(guī)范

IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用經(jīng)處理石英（熔融純氧化硅）纖維編織物規(guī)范

IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造數(shù)據(jù)質(zhì)量定級體系

IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工藝, 容量, 質(zhì)量,可靠性試驗標(biāo)準(zhǔn)和數(shù)據(jù)庫

IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 實施統(tǒng)計過程控制(SPC)的通用導(dǎo)則

IPC-9199 Statistical Process Control (SPC) Quality Rating 統(tǒng)計分析控制

IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未組裝印制板電測試要求和指南

IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制線路板通孔與焊盤的錯位: 原因和可靠性

IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多層板內(nèi)部無焊盤層互連錯位的可靠性

IPC-MS-810 Guidelines for High V olume Microsection 大批量顯微剖切導(dǎo)則

IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components &

Materials 印制板、元器件及材料檢驗試驗設(shè)備的認(rèn)證

IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄層壓板尺寸穩(wěn)走性試----國際聯(lián)合試驗計劃I階段及II階段報告

IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 內(nèi)層分離的互連應(yīng)力測試(IST)與顯微剖切相關(guān)性聯(lián)合研究

三、電子組裝（Assembly）

IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits電子電路互連與封裝的定義和術(shù)語

IPC-S-100 Standards and Specifications Manual標(biāo)準(zhǔn)和詳細(xì)說明匯編手冊

IPC-E-500 IPC Electronic Document Collection已出版的IPC標(biāo)準(zhǔn)電子文檔資料合訂本

IPC-TM-650 Test Methods Manual試驗方法手冊

IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program靜電釋放控制過程(由靜電釋放協(xié)會制定)

IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies電氣與電子組裝件錫焊要求

IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001輔助手冊及指南及修改說明1

IPC-A-610C Acceptability of Electronic Assemblies印制板組裝件驗收條件

IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手冊和指南(包括IPC-A-610B和C的對比)

IPC-EA-100-K Electronic Assembly Reference Set電子組裝成套手冊，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies電纜和引線貼裝的要求和驗收

IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒裝芯片及芯片級封裝技術(shù)的應(yīng)用

IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直裝技術(shù)實施導(dǎo)則

IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒裝芯片用半導(dǎo)體設(shè)計標(biāo)準(zhǔn)

J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒裝片）和CSP(芯片級封裝)的外形輪廓標(biāo)準(zhǔn)

IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒裝芯片及芯片級凸塊結(jié)構(gòu)的性能標(biāo)準(zhǔn)

SMC-WP-003 Chip Mounting Technology 芯片貼裝技術(shù)

J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球柵陣列(BGA)及其它高密度封裝技術(shù)的應(yīng)用

IPC-7095 Design and Assembly Process Implementation for BGAs球柵陣列的設(shè)計與組裝過程的實施

IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸點(diǎn)的標(biāo)準(zhǔn)規(guī)范

IT-98000 JPL Chip Scale Packaging GuidelinesJPL 發(fā)布的CSP導(dǎo)則注：

IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory)

IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 發(fā)布的BGA封裝導(dǎo)則

IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 關(guān)于芯片載體的報告ITRI (The Interconnect Technology Research Institute)

IPC-MC-790 Guidelines for Multichip Module Technology Utilization多芯片組件技術(shù)應(yīng)用導(dǎo)則

IPC-M-108 Cleaning Guides and Handbook Manual 清洗導(dǎo)則和手冊

IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?電路板離子潔凈度測量：它告訴我們什么？

IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及組裝件清洗導(dǎo)則

IPC-SC-60A Post Solder Solvent Cleaning Handbook 錫焊后溶劑清洗手冊

IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 錫焊后半水溶劑清洗手冊

IPC-AC-62A Aqueous Post Solder Cleaning Handbook 錫焊后水溶液清洗手冊

IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 電化學(xué)遷移：印制電路組件的電氣誘發(fā)故障

IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清潔度試驗計劃1階段試驗結(jié)果

IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3階段非清洗助焊劑研究

IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入離子潔凈度測試

IPC-9201 Surface Insulation Resistance Handbook 表面絕緣電阻手冊

IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3階段水溶性助焊劑清洗，第一和第二部分

IPC-M-109 Component Handling Manual 元件處理手冊

IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固態(tài)表面貼裝器件濕度／再流焊敏感度分類

IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 對濕度、再流焊敏感表面貼裝器件的處置、包裝、發(fā)運(yùn)和使用

IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非氣密封裝電子元件用聲波顯微鏡

IPC-9500-K Set of four documents 9501-9504 9501至9504手冊合訂本

IPC-DRM-18F Component Identification Desk Reference Manual 零件分類標(biāo)識手冊

IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接點(diǎn)評價手冊

IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接點(diǎn)評價手冊

IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual導(dǎo)線和端子預(yù)成形參考手冊

IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual電子組裝基礎(chǔ)介紹手冊

IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT標(biāo)準(zhǔn)合訂本

IPC-M-104 Standards for Printed Board Assembly Manual 10種常用印制板組裝標(biāo)準(zhǔn)合訂本

IPC-TA-722 Technology Assessment of Soldering 錫焊技術(shù)精選手冊

IPC-TA-723 Technology Assessment Handbook on Surface Mounting表面安裝技術(shù)精選手冊

IPC-TA-724 Technology Assessment Series on Clean Rooms 清潔室技術(shù)精選系列

IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安裝為主的元件封裝及互連導(dǎo)則

IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安裝焊接件加速可靠性試驗導(dǎo)則

IPC-PD-335 Electronic Packaging Handbook 電子封裝手冊

IPC-7525 Stencil Design Guidelines 網(wǎng)版設(shè)計導(dǎo)則

IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3階段受控氣氛焊接研究

IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收檢驗手冊

IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1錫焊焊劑要求（包括修改單1）

IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技術(shù)要求（包括修改單1）

IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能評價手冊

IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 電子設(shè)備用電子級錫焊合金、帶焊劑及不帶劑整體焊料技術(shù)要求

IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安裝用介電粘接劑通用要求

IPC-CA-821 General Requirements for Thermally Conductive Adhesives導(dǎo)熱膠粘劑通用要求

IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面貼裝導(dǎo)電膠使用指南

IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films各向異性導(dǎo)電膠膜的一般要求

IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板組裝電氣絕緣性能和質(zhì)量手冊

IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings敷形涂層的設(shè)計，選擇和應(yīng)用手冊

IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1

永久性阻焊劑的鑒定及性能(包括修改單1)

IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能評價手冊

IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001組裝工藝?yán)资线x擇法

IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊劑控制)的支持?jǐn)?shù)據(jù)及數(shù)字實例

IPC-AJ-820 Assembly & Joining Handbook 裝聯(lián)手冊

IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大規(guī)模焊接(回流焊與波峰焊)過程溫度曲線指南

IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安裝錫焊件性能試驗方法與鑒定要求

IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊劑雷氏選擇法

IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低殘留不清洗工藝的選擇和實施

IPC-S-816 SMT Process Guideline & Checklist 表面安裝技術(shù)過程導(dǎo)則及檢核表

IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除檢查表

IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安裝導(dǎo)則

IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和電子組裝件每百萬件缺陷數(shù)(DPMO)和制造指數(shù)的計算

IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板組裝過程中每百萬件缺陷數(shù)(DPMO)及合格率估計

IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 電子元

件的印制板組裝過程模擬評價

IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components電子元件的印制板組裝焊接過導(dǎo)則

IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成電路元件的濕度敏感度分級

IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成電路元件的組裝過程模擬評價（非集成電路元件預(yù)處理）

IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面貼裝設(shè)備性能檢測方法的描述（附Gerber格式CD盤）

IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面貼裝設(shè)備性能測試用的標(biāo)準(zhǔn)工具包?

IPC-9850 Placement Accuracy Verification Panels? 1 IPC-9850 CMM Measurement Verification Panels?

IPC-9850 QFP-100 Glass Components? 130 IPC-9850 QFP-208 Glass Components? 150 IPC-9850 BGA-228 Glass Components? NIST Traceable Measurement Certificate? Custom Storage Case

IPC-7711/21 7711 & 7721 Package 合訂本

IPC-7711 Rework of Electronic Assemblies 電子組裝件的返工

IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies印制板和電子組裝件的修復(fù)與修正

IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引線、端子、焊片、接線柱及導(dǎo)線可焊性試驗

IPC/EIA J-STD-003 Solderability Tests for Printed Boards 印制板可焊性試驗

IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰

焊故障排除檢查表

IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 帶保護(hù)性涂層印制板長期貯存的可焊性評價

IPC-TR-464 Accelerated Aging for Solderability Evaluations可焊性加速老化評價(附修訂)

IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器溫度控制穩(wěn)定性聯(lián)合試驗

IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化時間與溫度對可焊性試驗結(jié)果的影響

IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA替代涂覆層的蒸汽老化評價

IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test技術(shù)報告: 潤濕天平稱重標(biāo)準(zhǔn)對比測試

SMC-WP-001 Soldering Capability White Paper Report 可焊性工藝導(dǎo)論

SMC-WP-005 PCB Surface Finishes 印制電路板表面清洗